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| EMP212 UPDATED 04/04/2008 9.50 - 12.0 GHz Power Amplifier MMIC FEATURES * * * * * * 9.5 - 12.0 GHz Operating Frequency 30.5dBm Output Power at 1dB Compression 18 dB Typical Power Gain 43dBc OIMD3 @ EACH TONE Pout 19dBm APPLICATIONS Point-to-point and point-to-multipoint radio Military Radar Systems Dimension: 2500um X 1600um Thickness: 85um 15um ELECTRICAL CHARACTERISTICS (Ta = 25 C, Vdd*=7V, Idsq=800mA) SYMBOL F P1dB Gss OIMD3 Input RL Output RL Idss Vdd Rth Tb PARAMETER/TEST CONDITIONS Operating Frequency Range Output Power at 1dB Gain Compression Small Signal Gain Vdd=5V Output 3 Order Intermodulation Distortion @f=10MHz, Each Tone Pout 19dBm Ids= 60%10%Idss Input Return Loss Output Return Loss Saturated Drain Current Drain Voltage Thermal Resistance (Au-Sn Eutectic Attach) Operating Base Plate Temperature -35 Vds=3V, Vgs=0V 950 7 8.5 +85 rd MIN 9.5 29.5 15 TYP MAX 12.0 UNITS GHz dBm dB 30.5 18 -43 -10 -8 1250 -40 -7 -5 1500 8 dBc dB dB mA V o C/W C *Unless otherwise specified MAXIMUM RATINGS AT 25C1,2 SYMBOL VDS VGS IDD IGSF PIN TCH TSTG PT CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation ABSOLUTE 12V -8V Idss 114mA 27dBm 175C -65/175C 12.4W CONTINUOUS 8V -4 V 1300mA 19mA @ 3dB compression 150C -65/150C 10.4W 1. Operating the device beyond any of the above rating may result in permanent damage. 2. Bias conditions must also satisfy the following equation VDS*IDS<(TCH -THS)/RTH; where THS =Operating Base Plate temperature Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 1 of 2 Revised April 2008 EMP212 UPDATED 04/04/2008 9.50 - 12.0 GHz Power Amplifier MMIC ASSEMBLY DRAWING The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and separate the wires to minimize the mutual inductance. CHIP OUTLINE Chip Size 2500 x 1600 microns Chip Thickness: 85 15 microns PAD Dimensions: 100 x 100 microns All Dimensions in Microns Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com page 2 of 2 Revised April 2008 |
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